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1

Chemical bonds in damaged and pristine low-κ materials: A comparative EELS study

Heiko Stegmann, V. Burak Özdöl, Christoph Koch, Peter A. van Aken, Hans-Jürgen Engelmann, Pavel Potapov, Ehrenfried Zschech

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 534 KB

english, 2008

2

POSITIONIERUNG DES NEUEN SLK

Bernd Stegmann, Heiko Schmidt

Journal:

Year:

2011

Language:

german

File:

PDF, 842 KB

german, 2011

3

[AIP CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY 2005 - Richardson, Texas (USA) (15-18 March 2005)] AIP Conference Proceedings - Advanced EELS Applications in Process Development

Stegmann, Heiko

Year:

2005

Language:

english

File:

PDF, 702 KB

english, 2005

4

Characterization of Chemical Bonding in Low-K Dielectric Materials for Interconnect Isolation: A XAS and EELS Study

Hoffmann, Patrick, Schmeisser, Dieter, Engelmann, Hans-Juergen, Zschech, Ehrenfried, Stegmann, Heiko, Himpsel, Franz, Denlinger, Jonathan

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 211 KB

english, 2006

5

Electron tomography of inlaid copper interconnect structures

Stegmann, Heiko, Engelmann, Hans-Jürgen, Zschech, Ehrenfried

Journal:

Microscopy and Microanalysis

Year:

2003

Language:

english

File:

PDF, 461 KB

english, 2003

6

A combined solution exchange/plunge-freezing device for skinned muscle fibers

Heiko Stegmann, Rainer H. A. Fink

Journal:

Journal of Muscle Research and Cell Motility

Year:

1999

Language:

english

File:

PDF, 276 KB

english, 1999

7

Characterization of barrier/seed layer stacks of Cu interconnects by electron tomographic three-dimensional object reconstruction

Heiko Stegmann, Hans-Jürgen Engelmann, Ehrenfried Zschech

Journal:

Microelectronic Engineering

Year:

2003

Language:

english

File:

PDF, 637 KB

english, 2003

8

Preliminary Results from the First Monochromated and Aberration Corrected 200-kV Field-Emission Scanning Transmission Electron Microscope

Walther, Thomas, Stegmann, Heiko

Journal:

Microscopy and Microanalysis

Year:

2006

Language:

english

File:

PDF, 275 KB

english, 2006

9

2B1400 modeling of F-actin

Oda, T., Makino, K., Hasegawa, K., Stegmann, Heiko, Schroder, Rasmus, Namba, K., Maeda, Y.

Journal:

Seibutsu Butsuri

Year:

2002

File:

PDF, 232 KB

2002

10

Quantitative EELS of nitrided gate oxides

Stegmann, Heiko, Zschech, Ehrenfried

Journal:

Microscopy and Microanalysis

Year:

2003

Language:

english

File:

PDF, 623 KB

english, 2003

11

Quantification of total calcium in terminal cisternae of skinned muscle fibers by imaging electron energy-loss spectroscopy

Heiko Stegmann, Roger Wepf, Rasmus R. Schröder, Rainer H.A. Fink

Journal:

Journal of Muscle Research and Cell Motility

Year:

1999

Language:

english

File:

PDF, 219 KB

english, 1999

12

Compositional analysis of ultrathin silicon oxynitride gate dielectrics by quantitative electron energy loss spectroscopy

Stegmann, Heiko, Zschech, Ehrenfried

Journal:

Applied Physics Letters

Year:

2003

Language:

english

File:

PDF, 383 KB

english, 2003

13

Chemical Bonding, Permittivity and Elastic Properties in Locally Modified Organosilicate Glass

Zschech, Ehrenfried, Stegmann, Heiko, Hoffmann, Patrick, Schmeisser, Dieter, Potapov, Pavel, Engelmann, Hans-Juergen, Chumakov, Dmytro, Geisler, Holm

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 1.56 MB

english, 2006

14

[AIP FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2009 - Albany (New York) (11–15 May 2009)] AIP Conference Proceedings - Enhanced TEM Sample Preparation Using In-situ Low Energy Argon Ion Milling

Stegmann, Heiko, Ritz, Yvonne, Utess, Dirk, Hübner, René, Zschech, Ehrenfried, Secula, Erik M., Seiler, David G., Khosla, Rajinder P., Herr, Dan, Michael Garner, C., McDonald, Robert, Diebold, Alain

Year:

2009

Language:

english

File:

PDF, 3.23 MB

english, 2009

15

Quantitative EELS of nitrided gate oxides

Stegmann, Heiko, Zschech, Ehrenfried

Journal:

Microscopy and Microanalysis

Year:

2003

File:

PDF, 623 KB

2003

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